ALPHA®OM-350 是一种无铅免清洗焊膏，适合精细特征印刷以及在空气和氮气环境中使用最严苛的保温回流曲线的回流。ALPHA OM-350 出色的回流工艺窗口在 OSP 铜、浸银、浸锌、ENIG 和无铅 HASL 饰面提供了良好的焊接效果。ALPHA OM-350 符合 ROL0 IPC 和 IPC III 类空洞分类，确保最大程度提高长期产品可靠性。符合环境标准，包括 RoHS，可在全球范围内使用 ALPHA OM-350。
特点和优势
- Excellent Pin-in-Paste (Paste-in-Hole) Performance: demonstrated both for printing, dispensing (or pin transfer) SMT applications.
- Long Stencil Life: consistent performance for at least 6 hours of continuous printing without addition of new paste. 24 hour SMT production ability achieved from 20oC up to 32oC (68oF - 90oF) harsh environments.
- Stable Paste Viscosity: allows wide storage and handling window at temperatures up to 30oC for 21days,and up to 25°C for one month.
- High Tack Force: ensures high pick-and-place yields, good self-alignment and a low tomb-stoning defect rate.
- Wide Reflow Profile Window: allows best quality solderability of complicated, high-density PWB assemblies in both air and nitrogen reflow, using straight ramp or soak profiles up to 200°C.
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- Robust Solderability: proven to handle difficult wetting requirements of critical lead-free components, such as CSP and QFN…etc. on a variety of lead-free board finishes, OSP-Cu, Immersion Ag, Immersion Sn, ENIG & LF HASL.
- Reduced Random Solder Ball Levels: minimizes rework and increases first time yield.
- Voiding Performance: meets highest IPC classification of Class III for important ball grid array components.
- Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering even using long/high thermal soaking without charring or burning.
- First-rate Reliability Properties: excess variety of industry and customer standards, halide free material graded ROL0 according to IPC classification.
- Safe and Environmentally Friendly: materials comply with RoHS requirement, as well as TSCA & EINECS
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